DESCRIPTION
Low modulus neutral cure silicone adhesive/sealant.
FEATURES
One-component adhesive/sealant
Cures at room temperature when exposed to moisture in the air
Alkoxy cure system
Non-sag, paste consistency
Easy to apply
Low modulus for high movement capability
Good adhesion to many substrates
Stable and flexible from-5O°C(-58°F) to +180°C (+356°F)
APPLICATION
General industrial sealing and bonding applications where non-corrosive cure is required.